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PCBA FPC soft board High layer circuit board Special circuit board Consumer circuit board SMT process
High frequency tinplate
Product parameters
Product Name: High frequency sinking tin plate
Type: Special Circuit Board
Material: High frequency copper substrate, aluminum substrate, iron substrate, ceramic substrate
Base copper foil thickness: outer layer 1oz 2oz 3oz; Inner layer 1/2oz 1/3Oz
Minimum line width/spacing: 2mil/2mil
Minimum drilling diameter: 0.2mm
Minimum laser drilling aperture: 0.075mm
Blind hole depth ratio:
Maximum finished size: 500mm X600mm
Surface treatment: including lead spray tin, chemical immersion gold, immersion tin, immersion silver, full board gold plating, OSP, lead-free spray tin, hard gold plating, gold finger, mixed surface treatment
Solder mask colors: white, black, yellow, red, green, matte, blue
Special processes: high-frequency mixed pressing, back drilling, crimping holes, metal substrates, buried capacitor process, buried resistor process, etc
Detailed Introduction
Definition of Special Plate:
1. Special plates, such as high-frequency plates, have a very stable dielectric constant and minimal dielectric loss. Usually, the materials used are fluorine based dielectric materials, hydrocarbon+ceramic powder dielectric materials, and resin systems such as PPO and GE dielectric materials.
Copper substrate, aluminum substrate, iron-based plate, etc
2. Special processing technology: unique processing technology;
3. Special performance: such as high-frequency communication, high-speed transmission, high heat dissipation, etc
Product Name: High frequency sinking tin plate
Type: Special Circuit Board
Material: High frequency copper substrate, aluminum substrate, iron substrate, ceramic substrate
Base copper foil thickness: outer layer 1oz 2oz 3oz; Inner layer 1/2oz 1/3Oz
Minimum line width/spacing: 2mil/2mil
Minimum drilling diameter: 0.2mm
Minimum laser drilling aperture: 0.075mm
Blind hole depth ratio:
Maximum finished size: 500mm X600mm
Surface treatment: including lead spray tin, chemical immersion gold, immersion tin, immersion silver, full board gold plating, OSP, lead-free spray tin, hard gold plating, gold finger, mixed surface treatment
Solder mask colors: white, black, yellow, red, green, matte, blue
Special processes: high-frequency mixed pressing, back drilling, crimping holes, metal substrates, buried capacitor process, buried resistor process, etc
Detailed Introduction
Definition of Special Plate:
1. Special plates, such as high-frequency plates, have a very stable dielectric constant and minimal dielectric loss. Usually, the materials used are fluorine based dielectric materials, hydrocarbon+ceramic powder dielectric materials, and resin systems such as PPO and GE dielectric materials.
Copper substrate, aluminum substrate, iron-based plate, etc
2. Special processing technology: unique processing technology;
3. Special performance: such as high-frequency communication, high-speed transmission, high heat dissipation, etc
- Help you to save your cost and time.
- Reliable package for your goods.
- Fast Reliable Delivery to save time.
- Quality premium after-sale service.
